Micron Delays Construction Timeline for Semiconductor Fabs

Construction on Micron Technology’s semiconductor fabrication plants in Clay, New York, faces significant delays, according to a revised timeline included in the project’s approved Final Environmental Impact Statement (FEIS). The updated schedule indicates that while tree clearing will commence this year, the construction of four fabrication facilities, or fabs, will be postponed by several years to accommodate utility requirements.

Under the new timeline, the start of construction for Fab 1 is now set for the second quarter of 2028, with operations potentially beginning in the third quarter of 2030. This represents a two-year delay from the initial projections outlined in the Draft Environmental Impact Statement (DEIS). Similarly, the construction of Fab 2 will begin two years later than previously expected, with work starting in the last quarter of 2030 and operations not slated to commence until the final quarter of 2033, marking a three-year delay.

Extended Timeline for All Fabs

The timeline for Fab 3 has also shifted, with construction now beginning in the third quarter of 2035, a two-year postponement, while Fab 4’s completion has been pushed back by one calendar quarter, now expected by 2041. The revised construction schedule indicates that the overall process will take approximately 16 years and will be subject to the approval of necessary permits.

The FEIS highlights the impact of these delays on associated facilities. For instance, the construction of a childcare site will be rescheduled from 2026 to 2028, while the healthcare and recreation centers will now be initiated between 2030 and 2032. Additionally, securing warehouse space is now expected to occur by November 2028 due to the later start of wafer production.

Despite these adjustments, Micron anticipates that the final construction of the campus, including Fab 4, will still be completed by 2041. The facility is projected to reach full production by the end of 2045, creating over 9,000 permanent onsite operational jobs, according to the FEIS.

The revised timeline reflects Micron’s commitment to meeting utility needs while continuing to advance the development of its semiconductor production capabilities in Clay.